Thursday, July 7, 2011

Photo Stencil's NicAlloy-XT bridges gap between laser cut and electroformed stencils

COLORADO SPRINGS, USA: Photo Stencil, LLC, a leading full-service provider of high-performance stencils and tooling, introduced a new stencil technology, called NicAlloy-XT, for printing solder paste on printed circuit boards (PCB). NicAlloy-XT brings to market the best of NicAlloy and electroform stencils. It bridges the gap between traditional laser cut stencils and higher-end electroformed stencils.

"NicAlloy-XT is definitely a breakthrough technology as it enables PCB manufacturers to produce the exacting solder formations required by the highly populated, yet miniaturized boards now in demand, but at a lower price than they would have to pay for electroformed stencils," explained Neil MacRaild, CEO and president, Photo Stencil.

The NicAlloy-XT stencil meets challenging area ratios down to .46. It incorporates Photo Stencil's proprietary NiPlate process ensuring ultra-smooth aperture walls and offering superior paste release and improved under screen clean performance. Unique manufacturing processes produce uniform stencil thickness, and with NanoCoat as standard, it delivers the highest quality print deposit. The new NicAlloy-XT is more cost-effective than electroform stencils, yet provides higher performance and quality than traditional laser cut stencils.

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