Monday, March 25, 2013

Bestronics triples manufacturing facilities in San José

USA: Bestronics, provider of manufacturing, process engineering and test services for original equipment manufacturers, has tripled its manufacturing facilities to 71,750 square feet in a move to new quarters in San Jose’s International Business Park.

The company will celebrate its move at a ribbon-cutting ceremony hosted by San José Mayor Chuck Reed and other city officials at 11:00 am on Wednesday, March 27, 2013 at the Bestronics’ new headquarters, 2090 Fortune Drive.

“We are also celebrating the resurgence of local manufacturing in the city that launched some of the most inventive manufacturing-dependent companies in the world,” said Bestronics president, Nat Mani.

“Bestronics has seen many waves of manufacturing cycles in its 25 years in the Silicon Valley and, with these new facilities, is positioned to capture what promises to be a new groundswell of support for local manufacturing. We have already increased our team of highly-trained professionals and plan additional hires this year to support our growth.”

“I thank Bestronics for staying and growing its operations in San José and appreciate the company’s investments and commitment to create high-tech manufacturing jobs in the Capital of Silicon Valley,” said Mayor Reed. “We look forward to helping Bestronics to continue its growth in the years ahead.”

According to Mary Wadden, associate VP for Cassidy Turley who represented Bestronics in the lease: “The vacancy rate for research and development space in Silicon Valley is at the lowest levels seen since 2000. The vacancy rate is approximately 14.5 percent down from a high of 26 percent in 2003.”

Bestronics specializes in high-mix, lower-volume manufacturing for high technology companies who require exacting quality with the convenience of local sourcing at a competitive cost.

Bestronics offers facilities and trained staff supporting electro-mechanical and system assembly, reliability, precision touch-ups, in-circuit and functional tests, rework and failure analysis, final test, integration and box builds, a wide variety of SMT packaging and new clean room assembly capability.

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