International Conference on Planarization/CMP Technology (ICPT), PORT WASHINGTON, USA: Interactions between nanoparticles and filter media is the topic of a recent research study conducted by Lewis University (Romeoville, IL) in collaboration with Pall Corp.
The findings of the study will be presented by Pall at the International Conference on Planarization/CMP Technology (ICPT), Nov. 9-11 in Seoul, Korea. The conference is an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on research in chemical mechanical planarization (CMP) technology.
In semiconductor manufacturing, the reduction of wafer defects can lead to improved process yields and lower overall processing costs. The findings from the Abrasive Nanoparticle/Filter Media Interactions study will be utilized to provide more tailored product solutions for CMP applications that can help ensure product quality and potentially reduce defects. Patrick Levy, CMP product manager for Pall, will present the findings. Lewis University Assistant Professor of Chemistry Dr. Jason Keleher and Alumnus Vince Schade performed the research, which was sponsored by a Pall Corporation grant.
“Pall’s decision to work with Lewis University was based on an evaluation of the knowledge, experience, and dedication of the Chemistry department in the fields of nanotechnology and CMP,” said Steve Chisolm, senior corporate VP, Pall Microelectronics. “Collaboration with leading educators and researchers, such as Lewis University, is an important part of Pall’s technology development process and is critical to the continued advancement of filtration solutions for microelectronics.”