SANTA CLARA, USA: Intelleflex, a leader in Extended Capability RFID, has announced its next generation, standards based Battery Assisted Passive (BAP) XC3 technology platform.
The XC3 technology platform, comprised of RFID chips, tags, reader modules, fixed readers and mobile hand held readers, supports both the existing EPCglobal Class 1 Gen 2 standard and the emerging ISO 18000-6C Class 3 standard, which just received final technical approval.
The Intelleflex XC3 technology platform provides industry leading BAP RFID performance and capabilities that are normally associated with active RFID solutions, such as: read/write operating ranges up to 100 meters, 60 kbits of on-chip extended memory, security using multi-layer password protection and over-the-air data encryption, and sensor support.
These capabilities come at a significantly lower price point than traditional active tags and will enable applications previously not served due to prohibitive tag cost. Intelleflex is upgrading their existing tag and reader family with the new XC3 technology.
“Our customers have been asking for solutions that provide better visibility into, and management of, their cold chain operations,” said Jeff Wells, President and CEO of Franwell, an RFID software integrator and solutions provider.
“Existing solutions are either too costly or lack the performance required in RF challenging environments. Intelleflex’s XC3 technology is the first RFID solution to meet our customers’ needs, providing the performance required at the right price. We are looking forward to implementing solutions for our customers based on the Intelleflex XC3 technology.”
“The Intelleflex XC3 technology represents a breakthrough for RFID as it enables cost effective, real time access to tag data even when the tag is buried in a pallet of produce or a sealed package,” said Peter Mehring, President and CEO of Intelleflex.
“Delivering extended capabilities, such as reading or writing tags at up to 100 meters or accessing real time sensor data from tags buried in RF challenging product, all at a compelling price point, provides a new tool to significantly increase cold chain visibility and improve logistics management. No longer will transporters and customers have to manually retrieve data collection devices from their shipments or incur product losses due to a lack of supply chain visibility.”
The new Intelleflex platform provides unique benefits and significant ROI for many applications and industries, including: asset tracking, cold chain management, manufacturing WIP control, construction, agriculture, reusable container tracking, vehicle/yard management and many others.
Intelleflex will be demonstrating their new XC3 platform at the upcoming RFID Journal Live Show in Orlando, Florida, April 14-16 at Booth 660. As part of a technology demonstration highlighting the platform’s capabilities, Intelleflex will be showing a new XC3 platform tag with integrated temperature sensing and data logging.
Also at its booth, Intelleflex will be providing a white paper explaining the new ISO BAP Class 3 standard, and how it can be used to generate significant ROI in specific markets and applications. The new platform components will sample in June, with general availability in the third quarter.