ST. FLORIAN, AUSTRIA: EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the EVG580 ComBond―a high-vacuum wafer bonding system, which enables electrically conductive and oxide-free covalent bonds at room temperature.
Built on a modular platform to support high-volume manufacturing (HVM) requirements, the new system is ideally suited for bonding different substrate materials together in order to enable higher-performing devices and new applications, including:
* Multi-junction solar cells
* Silicon photonics
* High-vacuum MEMS packaging
* Power devices.
Compound semiconductor and other advanced engineered substrates for "beyond CMOS" applications such as high-mobility transistors, high-performance/low-power logic and radio frequency (RF) devices.
Several EVG580 ComBond systems have already been shipped to device manufacturers and R&D centers. Customer demonstrations are available at EVG's corporate headquarters in St. Florian, Austria.