USA: Invensas Corp., a wholly owned subsidiary of Tessera Technologies Inc., will display its latest xFDTM design wins and product implementations at Computex Taipei, June 4-8, 2013.
These include tablet and Ultrabook solutions from ASUSTeK Computer Inc. featuring SK hynix DRAM memory, Dell Inc. notebooks fabricated by Compal Electronics, Inc., and Intel Xeon-based servers featuring standard registered Dual Inline Memory Modules (DIMMs) and Hypercloud DIMMs from Netlist Inc.
The xFD, or “multi-chip face-down” semiconductor packaging solution, mounts the memory chips in an upside-down shingle-stack configuration, and then uses ultra-short wire-bonds to connect the chips to a Ball Grid Array (BGA) substrate.
Multiple configurations of chip stacks are possible: in one version, Double Data Rate (DDR) DRAM chips are stacked to produce enterprise solutions for network and datacenter products, in another, mobile DRAM chips are stacked to produce solutions for tablets and Ultrabooks. In all cases, the solutions significantly reduce component size (by up to 75 percent), increase bandwidth, speed and power performance (by greater than 50 percent), and reduce total system cost.
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