LAGUNA NIGUEL, USA: Symwave Inc., a leading silicon supplier of system solutions for SuperSpeed USB devices, announced that its USB 3.0 storage controller has been chosen by the HotChips Symposium Program Committee.
The technical paper will be presented by Gideon Intrater, Symwave’s Vice President of Solutions Architecture at the HotChips Symposium 2009 to be held in Palo Alto, California, August 23-25, 2009.
HotChips - “A Symposium on High-Performance Chips” is the industry’s premiere venue focused on design innovation and performance advancement techniques.
Symwave’s presentation will introduce its USB 3.0 System-on-Chip (SoC) storage controller architecture and the associated engineering challenges in achieving both industry-leading performance and integration. The SoC will be used in both HDD and SSD external storage products and will include a bridge to the SATA interface.
The device supports USB 3.0’s data rate of 5Gbps with storage-specific IEEE 1619 and IEEE1667 standards for encryption and authentication as well as legacy USB 2.0 devices. New high-performance external storage products from Symwave’s Tier-1 OEM partners are expected to be available in late 2009.
“We are honored that Gideon’s presentation was selected by HotChips. This recognition by such a prestigious organization is a clear testament to the strength of our team and our engineering execution,” said Yossi Cohen, President and CEO of Symwave. “The momentum around USB 3.0 is growing rapidly and will provide Symwave a great opportunity for our family of high-performance devices leveraging this innovative architecture.”
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